【World Express】On Determining the Implementation System of Additional Public Offering for "Strengthening the Technological Development of Energy-Saving Electronic Manufacturing Substrates"

  NEDO，The New Energy and Industrial Technology Development Organization, implemented the additional public offering of "strengthening the technological development of energy-saving electronic manufacturing substrates", reviewed the two proposals received, and decided on the place of implementation of the plan, as shown in Annex 1.

Cause

  In order to strengthen the technical development of energy-saving electronic manufacturing substrate (to add public offering)

Project overview

  With the development of IoT and electrification, and the importance of further energy-saving of such equipment, people begin to pay attention to "energy-saving electronic technology". The competitive power semiconductor and semiconductor manufacturing equipment fields of Japanese enterprises have attracted the attention of all countries, and are stepping up development and mass production, in case that Japan might not be ensure a stable supply of products using these technologies in the future. The purpose of this project is not only to improve product performance to achieve energy conservation and low-carbon society, but also to ensure that the supply chain can produce stably. These products are the key to energy conservation. The manufacturing infrastructure of energy-saving electronic products will be strengthened, and the following research and development activities will be carried out.

  Research and development project [1] the development of new generation power semiconductor

[1] - 1 the development of Ga₂O₃  power semiconductor

[1] - 2 the development of large diameter intelligent silicon power semiconductor

  Research and development project [2] the development of semiconductor manufacturing device

  In addition, this additional public offering covers the research and development of "innovative technology/back-end process exposure system, such as 3D laminating related equipment" in the "Research and Development Project [2] Development of Semiconductor Manufacturing Device".