【Member News】iSABers Group Joins Hands with World's Top Forces to Explore the New Future of Low-Temperature Bonding 3D Integration Technology!

      August 3-4, 2025, the 2025 China International Low-Temperature Bonding 3D Integration Technology Conference (LTB-3D 2025 Satellite in China) was grandly held in Tianjin. As an important international conference in the field of semiconductor cryogenic bonding, this year's conference has drawn industry attention since its first landing in China, attracting more than 200 top experts and corporate representatives from over 20 countries including the United Kingdom, Singapore, Japan, Austria, the Netherlands, Germany, etc., to gather for in-depth exchanges on cryogenic bonding 3D integration technology and jointly promote the innovative development of the industry.

Focus on Technology, Cryogenic Bonding Leads the New Trend in Semiconductors

      The conference focused on six major themes including surface-activated bonding, hybrid bonding and 3D integration, and new low-temperature bonding processes and materials, bringing together the world's top research results:

      International Authority Sharing: 11 experts, including Professor Tadatomo Suga from The University of Tokyo /Meisei University and Professor Sheng Liu from Wuhan University, delivered keynote speeches covering the history, current status and future prospects of bonding technology.

      Deep Integration of Industry, Education and Research: Over 30 invited and oral reports from institutions such as the University of Oxford, the University of Tokyo and the Institute of Microelectronics of the Chinese Academy of Sciences showcased the latest breakthroughs in low-temperature bonding technology in areas such as materials, processes and devices.

Key guests at the conference

iSABers Group, Growing with the Industry

      iSABers group has always been committed to promoting the research and application of low-temperature bonding technology. During this conference with domestic and international experts, we deeply discussed technical difficulties and market opportunities, and showcased the company's profound accumulation in the field of low-temperature bonding equipment and material processes: Relying on independent innovation, iSABers group has formed a unique technical advantage in the field of low-temperature bonding. At the same time, through collaboration and communication with top international institutions and enterprises, we continuously improve our technological layout and support the coordinated development of the industrial chain. In the future, iSABers group will continue to focus on low-temperature bonding technology and provide more efficient solutions for the industry.

Looking Ahead to the Infinite Possibilities of Cryogenic Bonding Technology

      Driven by the triple forces of the explosive growth of AI computing power, advanced packaging, and the demand for the third wave of compound semiconductor materials, low-temperature bonding technology will become the core technical path to continue Moore's Law, giving rise to a new generation of heterogeneous integration solutions and providing an important opportunity for China's semiconductor industry to upgrade to high-end manufacturing.

      iSABers group looks forward to working with more partners to jointly promote the innovation and application of cryogenic bonding technology and inject new impetus into the industry.

About iSABers Group

      iSABers group is a high-tech enterprise in China specializing in semiconductor bond integration technology. The company 's core business covers the research and development and manufacturing of high-end bonding equipment and the asus-manufacturing of precision bonding processes. The technology is widely applied in cutting-edge fields such as advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration and MEMS sensors. Through the dual-wheel drive of "equipment manufacturing + process services", it builds full industrial chain solutions and has successfully developed four product matrices with independent intellectual property rights: Ultra-high vacuum room-temperature bonding systems, hybrid bonding equipment, hot-pressing bonding equipment and supporting process services. Through continuous technological innovation, the company is committed to providing high-precision, stable process and cost-effective bonding equipment and solutions for the global semiconductor industry chain, support to the rise of strategic emerging industries.