【Domestic News】Hangzhou Spectrum Semiconductor Completes Multi‑Hundred‑Million‑Yuan Series C Financing, Expanding Fourth‑Generation Semiconductor Gallium Oxide and Extreme‑Environment Power Technologies

      Recently, Hangzhou Spectrum Semiconductor Technology Co., Ltd. (hereinafter referred to as “Spectrum Semi”), an enterprise specializing in special‑purpose power chips and systems for extreme environments, has completed its Series C financing worth several hundred million RMB. The new investors cover 10 state‑owned and industrial capital institutions including Zhejiang Jiahe Changyue, Chengdu Innovation Venture Capital Co., Ltd. (Chengdu Kechuangtou), Shanghai Semiconductor Equipment and Materials Industry Investment Fund, Shandong Caijin‑affiliated Funds and Guizhou Guochuang.

      According to the company, the financing proceeds will be mainly allocated to iteration of fourth‑generation semiconductor Ga₂O₃ chips, capacity expansion of 230°C‑grade high‑temperature chip modules, R&D on high‑temperature robotic joints, as well as preliminary research in fields including space‑borne computing and controllable nuclear fusion power supplies.

      Founded in 2020, Spectrum Semi disclosed that its revenue hit RMB 230 million in 2025, ranking among the few profitable players in this track.

From General‑Purpose Power Semiconductors to the Extreme‑Environment Market

      Around 2020, the power semiconductor market enjoyed rapid growth. Numerous enterprises stepped into large‑scale application sectors including new‑energy vehicles, photovoltaics and energy storage. Instead of engaging in price competition in the general‑purpose market, Spectrum Semi focused its business on special‑purpose power chips and systems tailored for extreme environments.

      Unlike CPUs and GPUs, which are mainly responsible for data computation, power chips have to withstand high voltages and currents directly. As power ratings rise, systems impose higher requirements on conversion efficiency, heat dissipation performance and reliability. Special‑purpose power chips face far more complex operating conditions: besides high power, they may simultaneously endure extreme environmental factors such as high temperature, radiation and confined space.

      Xu Yili, Founder and CEO of Spectrum Semi, stated that the company’s products can currently endure ambient high temperatures of over 250°C. Under identical power conditions, the products feature smaller size and lighter weight, lower self‑heating, as well as high reliability under complex and harsh environments.

From Deep-Earth Energy Exploration to High-Temperature Power Systems

      Spectrum Semi made its first foray into the market of deep‑earth energy exploration.

      For applications like oil exploration, equipment has to work 8,000 meters underground or even deeper. As depth grows, formation temperature keeps rising, and temperatures in some operating environments can exceed 200°C. Meanwhile, the internal space of downhole drilling tools is limited. Therefore, power electronic systems shall not only resist high temperatures but also minimize footprint and self‑heating.

      “The ambient temperature is already 200‑300°C; if the device itself generates heat, the internal temperature may hit 300‑400°C,” Xu Yili commented. To enable long‑term operation of power systems above 200°C, merely adopting high‑temperature‑resistant chips cannot solve the problem. Components and materials including resistors, capacitors, transformers, substrates and packaging materials may also become weak links for system reliability. Failure of any single link may impair normal operation of the whole system.

      To tackle this challenge, Spectrum Semi has developed the HS‑MCM platform technology, which implements fully‑sealed hybrid packaging for special‑purpose power chips as well as peripheral circuits including drive and feedback circuits. As introduced, some of such components do not even have well‑established supply chain systems.

From Deep‑Earth Applications to Robotics and Commercial Spaceflight

      Since 2023, Spectrum Semi has further extended its technologies to commercial aerospace and started exploring application markets including special robotic joints. In the robotics sector, to realize faster movement speed and stronger jumping capacity, joint systems need to output higher instantaneous power without synchronous growth in size and weight. Meanwhile, heat generated by power boost will further undermine the reliability of joint systems.

      In industrial scenarios including petrochemical refining, steel manufacturing and electrolytic aluminum production, ambient temperature of equipment may hit 60‑70°C. After continuous operation of robotic joints, internal temperature rise may drive local temperatures above 100°C. Conventional electronic systems face stricter requirements for component reliability when exposed to such high‑temperature environments for long periods.

      Leveraging its prior technological accumulation in high‑temperature resistance, low self‑heating and miniaturization, Spectrum Semi took high‑temperature industrial robotic joints as its entry point to develop corresponding joint system modules. As demand for high power density keeps rising across the robotics industry, the company is also extending its reach to more conventional robotic application scenarios.

Gallium Oxide, AI Computing Centers and Fusion Power Supplies

      Based on its existing special‑purpose power technologies, Spectrum Semi is further exploring emerging applications. In the second half of this year, the company started to deploy power‑conversion systems for AI computing centers, and carried out preliminary R&D covering controllable nuclear fusion power supplies and high‑power UAVs.

      Upon completion of the Series C financing, the company will keep advancing R&D of fourth‑generation semiconductor Ga₂O₃ chips and aims to realize large‑volume shipments of “SiC + Ga₂O₃” hybrid power modules. Besides, it will conduct cutting‑edge research on power‑computing synergy for AI computing centers, Energy OS for space‑borne computing, and the solid‑state implementation of fusion power supplies.

      Judging from its current business layout, Spectrum Semi is striving to extend its proven extreme‑environment power technology capabilities from deep‑earth energy exploration to application scenarios including industrial robotics, commercial aerospace, AI computing and fusion energy — all of which set high requirements for power density, heat dissipation and reliability.

From Small-Batch Specialized Products to Scaled Manufacturing

      Along with business growth, Spectrum Semi has entered the phase of production‑line expansion and manufacturing‑system standardization.

      Xu Yili pointed out: in the company’s early days when its main offerings were small‑batch special‑purpose products with high unit prices, R&D capacity served as key support for resolving product‑related issues. Nevertheless, as customer orders scale up, clients have started paying close attention to the company’s production lines, equipment, manufacturing regimes and quality‑control systems.

      This means the enterprise’s core challenges are shifting from “whether the product can be developed” to yield performance, product consistency and large‑scale manufacturing capacity.

      At the large‑scale production phase, manufacturing workflows must shift from flexible engineering adjustments typical of the R&D phase to a standardized, repeatable manufacturing system. Clear specifications shall be established covering every procedure’s workflow, material management and production‑process control.

      Xu Yili stated that manufacturing consistency stands as one of the biggest challenges after scaling‑up. For this reason, the company will invest a considerable share of funds into production‑line standardization and capacity expansion.

Key to Cross‑Scenario Technology Replication Lies in Problems to Be Solved?

      From oil exploration and robotics to computing centers, requirements for power, voltage, current and operating environments differ markedly across industries. When evaluating new applications, Spectrum Semi does not merely rely on market size; instead, it first examines whether its own technical strengths can tackle the core problems of the target sector.

      Xu Yili commented that the company’s underlying technologies feature certain reusability, given that all applications revolve around power chips and power systems. Despite disparate requirements for power, voltage and current across sectors, the fundamental technical principles stay essentially unchanged.

      For instance, energy exploration mainly deals with high‑temperature and confined‑space conditions; robotics needs to simultaneously realize high power, light weight, miniaturization and heat control; as power demands keep surging for computing centers, higher bars are set for power conversion and heat dissipation.

      Hence, before stepping into a new industry, the company first judges whether its “special‑purpose technical strengths” can be brought into full play, and then assesses market size and commercialization potential.

      From Xu Yili’s perspective, the long‑standing demand can be summarized as “higher power output without growing size or excessive self‑heating”. So long as this core contradiction persists, the technologies accumulated by the company will have chances to expand into new application scenarios.