Member Intro
【Member Intro】Shandong Liguan Microelectronics Equipment Co.,Ltd —— Regular Member
日期：2024-05-21阅读：312
Company Profile
Shandong Liguan Micro Electronic Equipment Co., Ltd. was established in 2013 and officially joined the China Electronic Production Equipment Industry Association in June. In November 2018, it was recognized as a "high-tech enterprise" by the Department of Science and Technology of Shandong Province. In March 2019, it was named the vice chairman unit of China Advanced Semiconductor Industry Innovation Alliance (CASA) and won the winner of the China Innovation and Entrepreneurship Competition and the International Advanced Semiconductor Professional Competition in September of the same year. In 2022 and 2023, it was recognized as “Innovative Small and Medium Company” and “Specialized and Sophisticated SME” by the Department of Industry and Information Technology of Shandong Province respectively. It was awarded the "Excellent Supplier Award" by the chairman of Taiwan Global Wafers Co., Ltd., the world's second-largest silicon wafer manufacturer. The company's products cover the first generation to the fourth generation of semiconductor material process equipment, all have independent intellectual property rights, are completely independent and controllable, and are widely used in integrated circuits, power semiconductors, compound semiconductors, 5G chips, optical communications, MEMS and other new electronic device manufacturing fields. The company has become a semiconductor material process equipment manufacturer integrating R&D, production and sales.
1、Technological Innovation
Shandong Liguan is a professional semiconductor equipment manufacturer; the company's products cover the first generation to the fourth generation of semiconductor material process equipment and can provide a complete material process package. The main representative products are PVT single-crystal growth equipment, HVPE single-crystal growth equipment, 8-inch/12-inch vertical oxidation diffusion equipmet, SiC high-temperature oxidation/annealing equipment and other products. The stability and uniformity of the full set of production processes have reached the international leading level. All have independent intellectual property rights, completely independent and controllable.
The company has a strong technical force. Up to now, it has authorized 30 patents, including 4 invention patents.
The company's products are widely used in integrated circuits, power semiconductors, compound semiconductors, 5G chips, optical communications, MEMS and other new electronic device manufacturing fields. The equipment has completely independent intellectual property rights, which can realize real domestic substitution. The export of semiconductor products to Taiwan, South Korea, Singapore, Russia and other regions can break the technology monopoly dominated by foreign enterprises such as the United States and Japan.
After ten years of development, it has become a semiconductor material process equipment manufacturer integrating R&D, production and sales.
2、Talent Introduction
The technical team led by General Manager Song Depeng: the backbone of the R&D team, technical team, and material process team are from well-known semiconductor enterprises in Japan, Taiwan, and other enterprises. The company attaches great importance to the introduction of talent, with all kinds of specialized technicians, of which the R&D personnel with a doctor's degree or above account for more than 25%.
3、School-Enterprise Cooperation
As a national high-tech enterprise, the company has maintained close cooperation with well-known domestic semiconductor enterprises and well-known universities and research institutes.
Relying on the advantages of Shandong Liguan industry, technology and talents, the company has established a sound and perfect talent selection and training mechanism, perfected the talent incentive mechanism, and paid attention to the training of high-quality talents. To realize the seamless connection between the vocational ability of college graduates and the job needs of enterprises, effectively do a good job in enterprise talent cultivation and echelon construction, and truly cultivate high-quality technical and skilled talents with the strong practical ability and the spirit of exploration and innovation.
4、Future Planning
1.Support the fourth-generation semiconductor equipment special technology research.
We will fight hard for key core technologies, focus on the application needs of 5G communications, artificial intelligence, automotive electronics, cloud computing and other strategic industrial fields, and carry out key core technology research on fourth-generation semiconductor manufacturing equipment. We will strengthen the protection and application of invention patents, trademarks, software copyrights and other intellectual property rights.
Make full use of the advantages of factor resources in the semiconductor field in Jinan, seize new opportunities in the semiconductor industry, and build a professional communication and public service platform covering semiconductor enterprises, research institutes, government departments, public service institutions and machine manufacturing enterprises, and establish a community of interests in the industrial chain. Gradually build a symbiotic industrial ecosystem of whole machine systems and integrated circuit products. Establish a regional collaborative innovation system of "technology R&D + achievement transformation + industrial application". Follow the principle of "increasing technology in the industrial chain and gradually improving the value chain", and strive to build an influential regional semiconductor industry development highland.
2.Strengthen cooperation with high-level research institutes and increase the construction of innovation carriers
Strengthen cooperation and exchanges between domestic and foreign enterprises and research institutes, and jointly build high-level R&D, production, and operation centers. Continue to promote collaboration and innovation with high-level research institutes, build academician workstations, postdoctoral workstations and other collaborative innovation platforms for government, industry, university and research in the field of semiconductor equipment manufacturing, and form a situation of multi-platform and broad fields to jointly promote innovation in the field of semiconductor equipment manufacturing. It strives to become a domestic first-class and international high-end strategic scientific and technological innovation platform in the field of advanced manufacturing science and technology. It is committed to becoming a dynamic high-end equipment supplier and new material preparation process service provider, promoting the high-quality development of China's semiconductor industry, and making greater contributions to scientific and technological progress and economic development.
Main Product Introduction
(1) Compound Crystal Equipment
1、HVPE Single Crystal Growth Equipment (horizontal/vertical)
Product Overview
(1) For Gallium Nitride (GaN) single crystal growth
(2) For Gallium Oxide (Ga2O3), Aluminum Nitride (AIN), Indium Phosphide (InP), Gallium Arsenide (GaAs) and other epitaxial growth
Product Characteristics
Basic process package
(1) Gallium Nitride (GaN) single crystal growth size: 2 inches
(2) Single crystal growth rate ≥50 microns/hour
(3) Thickness of Gallium Nitride (GaN) single crystal layer grown by epitaxial growth at the bottom of sapphire village < 200 microns
Substrate size: 2/4/6 inches
Quantity: 1 tablet/multiple tablets
Structure: Vertical/horizontal structure is reasonable and reliable, which can meet the needs of customers with various sizes of substrates and various operation modes
Temperature control: High-temperature control precision and good stability in the temperature zone
Security protection: Perfect and reliable security protection function: hardware protection + software interlock.
2、PVT Single Crystal Growth Equipment
Product Overview
The equipment is mainly used for the single-crystal growth of Silicon Carbide (SiC) and Aluminum Nitride (AIN)
Product Characteristics
Two process packages are provided
- Shape package: 6-inch Silicon Carbide (SiC) single crystal is produced without cracking
- Process package:
Crystal form: 4H
Resistivity: 0.015 ~ 0.025ohm·cm
Diameter: 150.25±0.25mm
Thickness: ≥15mm
Microtubule density: ≤3ea/cm2
TSD: < 1000ea/cm2
Temperature up to 2400℃
Heating mode: induction and resistance
Substrate size: 4/6/8 inches
3、Crystal Lifting Equipment
Product Overview
Special equipment for Czochralski crystal growth, which can realize Czochralski crystal growth under high pressure, vacuum and protective atmosphere
Adopting automatic weighing structure, the automatic growth process of Czochralski crystal is realized on the premise of ensuring crystal quality
Product Characteristics
High-precision sensor and control software
Automatic control of crystal shape
Maximum temperature:2400℃
Crystal size:2-8 inches
Scope
Applied to Gallium Oxide(Ga₂O₃)Single Crystal Growth, SiC Single Crystal Growth and Laser Single Crystal Growth
4、SiC Seed Crystal Bonding Equipment
Product Overview
The bonding technology of seed crystal is to bond SiC seed crystal to graphite paper through organic adhesive. Improving the bonding quality of seed crystal is the first prerequisite to ensure the growth of high-quality SiC crystal.
5、MPCVD Equipment
Product Overview
Microwave plasma chemical vapor deposition (MPCVD) technology, through the plasma to increase the reaction rate of the precursor, reduce the reaction temperature. It is suitable for preparing diamond single crystal and polycrystalline films with large area, good uniformity, high purity and good crystal morphology.
6、Crucible Lowering Equipment
Product Overview
Mainly used for single crystal growth of 4-8 inch arsenide, phosphide and other compounds.
The equipment is composed of a frame, safety support mechanism, heater and control system.
Able to achieve precise control of Ann's movement and rotation.
7、Graphene Film CVD Equipment
Product Overview
This system is a complete graphene preparation system, including hardware and software.
Working in a normal pressure atmosphere or vacuum conditions, by controlling the growth process, both hexagonal graphene single crystal and petal-shaped graphene single crystals can be grown.
8、Graphene Roll-to-roll Equipment
Product Characteristics
Graphene film industrialization equipment
Wide roll-to-roll continuous growth
APC system: vacuum butterfly valve automatic control
MFC control of carbon source and other process gases
Automatic control of film preparation process
Three-chamber structure
(2) Advanced Semiconductor Furnace
1、SiC High-temperature Oxidation Equipment
Product Overview
It is specially used for the oxidation treatment of Silicon Carbon Compound (SiC), which can realize the high-temperature oxidation process of SiC wafer in high-temperature environment. The oxidation process uses O2, O2/H2, NO2, NO, which is the safest toxic gas oxidation furnace.
The equipment is suitable for high-temperature oxidation process in the manufacture of SiC-based power devices.
The heating chamber and the process chamber are independently sealed and designed to provide the cleanliness of the process chamber.
2、SiC High-temperature Annealing Equipment
Product Overview
It is specially used for ion activation and annealing treatment of Silicon Carbon Compound (SiC), which can realize the active process of SiC wafer in high-temperature vacuum environment.
The equipment is suitable for ion activation and annealing processes in the manufacture of SiC-based power devices.
The heating chamber and the process chamber are independently sealed and designed to provide the cleanliness of the process chamber.
3、LPCVD Furnace (vertical)
Product Overview
LPCVD equipment is one of the important equipment for semiconductor integrated circuit manufacturing, which is mainly used for the growth of Polysilicon, Doped Polysilicon, Silicon Nitride and Silicon Oxide Thin Films.
Vertical LPCVD adopts bell jar structure, and designs nested cavity manipulator film transmission assembly and boat rotation assembly, which has the advantages of small occupied area, high film formation uniformity and high process stability.
4、LPCVD Furnace (horizontal)
Product Overview
LPCVD equipment is one of the important equipment for semiconductor integrated circuit manufacturing, which is mainly used for the growth of Polysilicon, Doped Polysilicon, Silicon Nitride and Silicon Oxide Thin Films.
5、PECVD (vertical/horizontal)
Product Overview
PECVD is mainly used for thin film growth of Silicon Oxide (SiO2) and Silicon Nitride (SiN4) materials.
6、Oxidation/Diffusion/Synthesize Furnace
Product Overview
The equipment is one of the important process equipment in the front process of the semiconductor production line, which is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices.
Mainly used in the preparation process of various oxidation dielectric layers such as the initial oxide layer, shielding oxide layer, gasket oxide layer, sacrificial oxide layer and field oxide layer.
7、Vacuum Annealing Equipment
Product Overview
Mainly used for annealing and sintering of semiconductor devices, and can be protected by vacuum and gas.
The equipment has novel structure and convenient operation.
Multiple process flows can be completed on one equipment.
