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【Member Papers】1380 V β-Ga₂O₃ trench MIS-type Schottky barrier diode with ultra-low leakage current

日期:2025-04-15阅读:78

      Researchers from the University of Electronic Science and Technology of China have published a dissertation titled "1380 V β-Ga2O3 trench MIS-type Schottky barrier diode with ultra-low leakage current " in Japanese Journal of Applied Physics.

 

Background 

      β-gallium oxide (β-Ga2O3) is very attractive for high-voltage power devices, due to its wide bandgap ranging from 4.5 to 4.9 eV, high critical breakdown electric field of 8MV cm−1, adjustable n-type doping concentrations spanning from 1014 to 1019 cm−3, moderate electron mobility of ∼200 cm2 V−1·s−1 and relatively low production costs. Recently, β-Ga2O3 has been widely used to fabricate high-performance power devices, such as Schottky barrier diodes (SBDs), heterojunction PN diodes using p-type NiO (HJDs), metal–oxide semiconductor field-effect transistors, and modulation-doped field-effect transistors. Research on these devices shows that β-Ga2O3 is a promising material, and promotes the developments and applications of β-Ga2O3 power devices.

 

Abstract

      A β-Ga2O3 trench Schottky barrier diode (T-SBD) with double-field-plates terminal and cost-effective Al2O3/SiN dielectric layer is fabricated. Owing to the shielding effect of the trench metal–Insulator–semiconductor structure, compared with conventional SBD (C-SBD), the breakdown voltage of the T-SBD is improved from 700 V (C-SBD) to 1380 V (T-SBD) with specific on-resistance (Ron,sp) being 6.06 mΩ·cm2. Compared to C-SBD, Baliga's figure of merit for the T-SBD is improved from 131 MW cm−2 (C-SBD) to 314 MW cm−2 (T-SBD). Moreover, the leakage current of T-SBD is significantly reduced from ∼0.33 mA cm−2 (C-SBD) to ∼38 μA cm−2 (T-SBD).

 

Summary

      In conclusion, we fabricated a β-Ga2O3 trench Schottky barrier diode with a double-field-plates terminal and costeffective Al2O3/SiN dielectric layer. Compared with conventional SBD, the breakdown voltage of T-SBD is improved from 700V (C-SBD) to 1380V (T-SBD), with little increase in Ron,sp. The Baliga’s figure of merit is improved by 139.7%. Moreover, the leakage current of T-SBD is significantly reduced by 88.5% compared to that of conventional SBD. This work shows that trench β-Ga2O3 SBD has great potential in the field of high-voltage and low-leakage current applications.

 

Graphic Example

Fig. 1. (a) Illustration of fabricated T-SBD along AA’ in Fig. 1(a), (b) layout design in T-SBD. The red pattern represents the Fin region (Schottky region) and the blue pattern represents the Ni. The outer Ni circle is just to define the active region.

Fig. 2. Measured IV curves for the fabricated C-SBD and T-SBD. (a) Linear axis. (b) Semi-log axis.

 

DOI:

doi.org/10.35848/1347-4065/adc053