【Member Intro】South University of Science and Technology——Regular Member

Introduction

  School of Microelectronics, South University of Science and Technology is a secondary college built by South University of Science and Technology in the context of the strategic planning of Guangdong & Hong Kong & Macao Greater Bay Area, which is based on innovative school mission and mechanisms and in cooperation with world famous universities in the Greater Bay Area. The college was officially established in January 2019, as the national model microelectronics developing college. The college has built a first-class scientific research platform, micro nano process R&D platform and IC design and test platform. The college focuses on four research fields: integrated circuit design methodology, integrated circuit chip design, integrated circuit manufacturing and process, micro nano system and integration. And it has obtained several national, provincial and municipal qualifications in the scientific research field, including the National Model Microelectronics College (28 in China, only 3 in South China), Future Communication Integrated Circuit Engineering Research Center of the Ministry of Education, Guangdong GaN Device Engineering Technology Research Center, Guangdong 3D Integration Engineering Research Center and Shenzhen Key Laboratory of the Third Generation Semiconductor Devices. Focusing on the semiconductor industry chain, we will strengthen the research and development of core technologies and personnel training, which will play a supporting role in the development of the integrated circuit industry in the whole Guangdong & Hong Kong & Macao Bay Area, and even in the whole country.

Achievements

  The main research directions of the college includes integrated circuit design methodology, artificial intelligence chip, integrated circuit manufacturing and process, micro nano system and integration, etc.

1、Integrated Circuit Design Methodology

  The research focuses on integrated circuit design methodology, integrated circuit simulation, physical design automation technology, and corresponding development tools, system design platforms, etc. Research achievements include the Best Paper Award of the Computer Association, the Best Paper Nomination Award of IEEE/ACM ICCAD (EDA Top Conference), and the National Natural Science Key Projects.

2、Artificial Intelligence Chip

  The research team focuses on the integrated circuit design of high-performance artificial intelligence, communication and sensing. It has been approved as the Future Communication Integrated Circuit Engineering Research Center of the Ministry of Education, the key research and development plan of the Ministry of Science and Technology, and a Peacock Team in Shenzhen. Several achievements were published in IEEE and other journals.

3、Integrated Circuit Manufacturing and Process

  Facing the demand for devices beyond the Moore era, we will do researches on new materials, new devices and new processes, focusing on broad band-gap semiconductors, storage-computing integrated devices and other key directions.

4、Micro nano system and integration

  We do researches on post Moore IC packaging technology, system packaging technology, wafer level packaging technology, 3D heterogeneous integration method, micro nano system design, micro assembly and verification testing. We have been approved as Guangdong 3D Integration Engineering Research Center, which closely follows the major needs of the country and the development of the integrated circuit industry. We conducts near industrial research and development around 3D integration, and conducts technological pre research and talent reserve for Shenzhen Chip Laboratory (preparatory).