【Member News】CSEAC 2025 Concludes Successfully, iSABers Group’s Bonding Solutions Gain High Recognition from the Industry

      From September 4 to 6, 2025, the 13th Semiconductor Equipment, Core Components, and Materials Exhibition (CSEAC 2025) was successfully held at the Taihu International Expo Center in Wuxi. As one of the most authoritative and influential annual events in China’s semiconductor equipment, core components, and materials sector, CSEAC has always adhered to the principles of professionalism, industrialization, and internationalization. The event gathered cutting-edge technologies and innovative forces from across the global supply chain, building a high-end platform that integrates technology exchange, business cooperation, and market expansion.

      iSABers Group, as an innovator in advanced bonding integration technologies and equipment, showcased its latest achievements in bonding equipment and process services at CSEAC 2025.

Exhibition Highlights: Technology Leadership, In-Depth Engagement

      During the exhibition, iSABers Group’s booth drew significant attention, attracting numerous representatives from domestic and international enterprises as well as experts and scholars from research institutes. Participants engaged in in-depth discussions and practical exchanges on core technological challenges and innovation pathways in the industry. The strong atmosphere of technical dialogue and the enthusiastic response underscored the high recognition of iSABers Group’s bonding equipment and process services, further highlighting the company’s professional strength and brand influence in the semiconductor bonding field.

Keynote Presence: Sharing Insights, Leading the Technical Dialogue

      Dr. Fengwen Mu, Founder and Chairman of iSABers Group was invited to deliver keynote speeches at several important forums during the event.

      On September 4, at the 13th Semiconductor Equipment, Core Components and Materials Exhibition, Dr. Mu delivered a keynote speech titled “Advanced Semiconductor Bonding Integration Technologies.” He emphasized that bonding technology, as a key pathway for material fusion and 3D integration, can overcome the limitations of traditional epitaxy and address core challenges such as heterogeneous material integration and performance enhancement. He further highlighted iSABers Group’s strategic layout in leading technologies, including ultra-high vacuum room-temperature bonding, hybrid bonding, and surface treatment, as well as the company’s full coverage of high-end equipment and process services. These advances provide critical support for advanced packaging, optoelectronic integration, and compound semiconductors. His insightful presentation received wide recognition from attending experts and audiences.

      On the following day, at the  the 17th Integrated Circuit Packaging and Testing Industry Chain Innovation and Development Forum, Dr. Mu once again took the stage with a speech entitled “Hybrid Bonding Integration Technology in the Era of Advanced Packaging.” He explored the fundamental principles of hybrid bonding and current industry pain points, presented iSABers Group’s innovative solutions, and demonstrated the company’s core capabilities in driving packaging technology toward miniaturization, integration, and heterogeneity. His speech was highly acclaimed by experts across the industry.

Looking Ahead: Strengthening Collaboration, Building a Shared Future

      For iSABers Group, participating in CSEAC 2025 was not only a concentrated showcase of its technological and brand strengths but also a valuable opportunity to engage deeply with global semiconductor industry partners. The company will continue to work hand-in-hand with industry peers, dedicated to overcoming key challenges in semiconductor equipment and bonding technologies, breaking through technical bottlenecks, and driving independent innovation and sustainable upgrades of the industrial chain. Together, iSABers Group and its partners aim to shape a new technological future defined by integration and heterogeneity.

About iSABers Group

      iSABers group is a high-tech enterprise in China specializing in semiconductor bond integration technology. The company 's core business covers the research and development and manufacturing of high-end bonding equipment and the asus-manufacturing of precision bonding processes. The technology is widely applied in cutting-edge fields such as advanced packaging, semiconductor device manufacturing, wafer-level heterogeneous material integration and MEMS sensors. Through the dual-wheel drive of "equipment manufacturing + process services", it builds full industrial chain solutions and has successfully developed four product matrices with independent intellectual property rights: Ultra-high vacuum room-temperature bonding systems, hybrid bonding equipment, hot-pressing bonding equipment and supporting process services. Through continuous technological innovation, the company is committed to providing high-precision, stable process and cost-effective bonding equipment and solutions for the global semiconductor industry chain, support to the rise of strategic emerging industries.