【Conference Information】2026 Future Semiconductor Industry Innovation Conference

Conference Overview

      Driven by the rapid advancement of artificial intelligence and high-performance computing, chip thermal design power has increased significantly, while cooling-related energy consumption continues to account for a growing share of global electricity usage. “Heat” has become a critical bottleneck constraining the development of the electronics industry. From individual chips to data center racks, high heat flux threatens device performance and reliability, and increasingly dictates electronic device design, fabrication processes, and system integration across the entire lifecycle. Thermal management is therefore evolving from a supporting function into a core source of industrial competitiveness.

      As the foundational pillar of the information technology industry, semiconductors are entering a period of profound transformation characterized by materials iteration, integration-driven innovation, and green low-carbon development. Wafer materials are shifting from “general-purpose” to “application-specific” solutions. Advanced materials such as wide bandgap semiconductors (SiC, GaN) and ultra-wide bandgap semiconductors (diamond, Gallium Oxide, AlN), with their ultra-high breakdown electric fields and excellent thermal properties, have become key enablers for overcoming the limitations of silicon-based technologies. In particular, their large-scale application in green computing and electric transportation represents a critical pathway toward achieving carbon neutrality goals. Meanwhile, heterogeneous integration and advanced packaging technologies enable coordinated use of multiple materials and chips to achieve balanced thermal–electrical–mechanical performance. Together with wide bandgap materials, they form the core technological foundation for next-generation electronic thermal management.

      Against this backdrop, Flink Qiming Industry Chain will host the “2026 Future Semiconductor Industry Innovation Conference” on April 16–17, 2026, in Suzhou, Jiangsu Province. Centered on (ultra-)wide bandgap semiconductor materials such as diamond, silicon carbide, gallium nitride, and Gallium Oxide, the conference will focus on two major value chains: “materials–devices–processes–equipment” and “heterogeneous integration–thermal management–packaging applications.” Key topics will include semiconductor material growth, high-thermal-conductivity substrates, heterogeneous integration, advanced packaging, and microchannel cooling technologies. The conference aims to explore thermal management trends for next-generation electronic devices, build a collaborative industry–academia–research platform, and support the development of a green computing ecosystem for the semiconductor industry.