【Member News】Accelerating the Industrialization of Gallium Oxide: Beijing Orient Semi Co., Ltd. Unveils New Products and Signs Strategic Partnership to Enable a Full “Chip–Packaging–Application” Value Chain

      On April 23, 2026, at the Jiufengshan Forum in Wuhan, Beijing Orient Semi Co., Ltd. completed two consecutive key moves: unveiling its Gallium Oxide epitaxial and power device engineering prototype product portfolio, and signing a strategic cooperation agreement with Changjiang Optoelectronics Industry Investment Co., Ltd.

      Viewed separately, these are a product launch and an industrial collaboration; taken together, they point to something more specific—centered on Gallium Oxide, the company is proactively building a pathway from technology to industrialization.

Anchored in products: directly targeting the high-voltage core segment

      The focus of this release is not merely that devices have been developed, but which performance range has been reached.

      The company’s devices span a full voltage range from 650V to 3300V. In particular, the 3300V-class products are aimed at high-voltage scenarios such as power grids and industrial inverters, targeting a longstanding gap: achieving both ultra-high breakdown voltage and low leakage with stable performance.

      This reflects a deliberate strategic choice—not starting with low-end substitution, but directly entering the high-voltage segment for capability validation.

      At the same time, these products have progressed to the engineering prototype stage, indicating a shift from laboratory validation toward practical applicability. For Gallium Oxide, this transition marks a meaningful inflection point.

Building on an internal loop: establishing a “materials–devices” closed-loop capability

      Beyond the products themselves, what matters more is the capability structure behind them.

      Leveraging its IDM model, Beijing Orient Semi Co., Ltd. has preliminarily established an internal linkage from epitaxial materials to power devices. In a system like Gallium Oxide, where materials and devices are highly coupled, such integration enables continuous feedback among material optimization, structural design, and device performance, rather than fragmented, step-by-step development.

      The resulting shift is not merely about efficiency—it represents a transition in the R&D paradigm from a linear process to a closed-loop system, laying the foundation for sustained iteration.

Extending outward: completing the “packaging” and “application” interfaces

      If the previous steps were focused on “making the devices,” the collaboration with Changjiang Optoelectronics Industry Investment Co., Ltd. represents a deliberate move by Beijing Orient Semi Co., Ltd. to extend downstream along the industrial chain.

      The two parties will collaborate across “chip design–advanced packaging–end applications,” with a focus on addressing thermal management and reliability challenges in high-voltage scenarios, while accelerating the deployment of power modules in applications such as data centers, new energy vehicles, and power grids.

      In the field of power semiconductors, whether device performance can be fully realized depends largely on packaging and system-level design. This also indicates that the company is not stopping at the device level, but is actively building a pathway for performance to translate into real-world applications.

Beyond “chip–packaging–application”: building mechanisms and ecosystem in parallel

      At the implementation level, both parties will further accelerate technology transfer through joint laboratories, cross-team collaboration, and shared intellectual property mechanisms.

      While such arrangements may appear routine, they carry clear significance in the new materials sector—they determine whether technologies can bridge the gap from laboratory to production.

      At the same time, by jointly applying for national-level projects and building a patent portfolio, the partnership is also positioning itself for greater influence in the global Gallium Oxide landscape.

From points to structure: Gallium Oxide begins to take on an industrial form

      When these steps are viewed together, a clearer picture emerges:

      The emergence of engineering prototypes indicates a shift beyond the laboratory stage

      A full voltage portfolio reflects system-level design capability

      The rollout of “chip–packaging–application” collaboration signals entry into coordinated industrial chain development

      Taken together, these developments mark a transition of Gallium Oxide from a “validated technology” to an “organizable industrial element.” In this process, Beijing Orient Semi Co., Ltd. is not only advancing the technology, but increasingly acting as a builder of the industrial pathway.