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【Patenes】Targeting Ga₂O₃ Thin-Film Transfer Challenges, Fujian Sunwise Semiconductor Proposes a Novel Wet-Etch Lift-Off Solution for ε-Ga₂O₃

日期:2026-06-16阅读:48

      Information from the China National Intellectual Property Administration shows that Fujian Sunwise Semiconductor Technology Co., Ltd. has filed a patent titled “A Wet-Etch Lift-Off Stack Structure for ε-Phase Gallium Oxide Thin Films and Its Preparation and Separation Methods.” The application publication number is CN122205926A, with application number CN2026100812007. It was published on June 12, 2026, and filed on January 21, 2026.

      According to the abstract, the invention discloses a wet-etch lift-off ε-phase Ga₂O₃ thin-film stacked structure, along with its preparation and separation methods, belonging to the technical field of semiconductor thin-film growth. The structure consists of a substrate, on which a superlattice layer and an ε-phase Ga₂O₃ layer are sequentially formed.

      The superlattice layer is composed of alternating first and second sublayers. The first sublayer may be a ZnO layer, ZnGaO layer, or ZnAlO layer, while the second sublayer is a GaOx layer. By introducing this stacked design, the invention enables efficient wet-etch lift-off of ε-phase Ga₂O₃ thin films, achieving high separation yield.

 

About Fujian Sunwise Semiconductor

      Fujian Sunwise Semiconductor is a globally leading developer and manufacturer of optoelectronic integrated chips (OEIC) and wide-bandgap compound semiconductor epitaxial thin-film materials. The company’s gallium oxide (Ga₂O₃) wafer technology is at an internationally advanced level.

      Fujian Sunwise has successfully developed high-quality Ga₂O₃ heterogeneous epitaxial growth processes and achieved mass production of 6-inch silicon-based Ga₂O₃ single-crystal piezoelectric thin-film wafers. The company is the first in the world to achieve high-quality, large-diameter Ga₂O₃ wafers on silicon substrates.

      The company provides Ga₂O₃ single-crystal thin-film heterogeneous bonding wafer materials (POI), as well as integrated solutions for high-frequency, high-power, and wide-bandwidth filter applications. Its products are widely used in 5G/6G communications, IoT, aerospace, new energy vehicles, advanced manufacturing, rail transportation, radar systems, and other strategic application fields.