【Conference Information】2026 The WESEMiBAY Semiconductor Ecosystem Expo（2026.10.14-10.16）

      The semiconductor industry is undergoing structural reshaping. The explosive growth of AI compute is driving advanced packaging, Chiplets and HBM to center stage. Domestic equipment and core components have entered a critical phase of verification and volume production, while compound semiconductors are gaining faster penetration in new energy and power electronics applications. Following the global chip shortage, chip development and manufacturing now hinge on the systemic capability of end-to-end industrial chain collaboration.

      Shenzhen’s “20+8” industrial cluster designates semiconductors and integrated circuits as strategic priority industries and executes the “one cluster, one exhibition” initiative. As “China’s No.1 industrial city”, Shenzhen is leveraging the three core segments — IC design, wafer fabrication, and advanced packaging & testing — to accelerate the development of a technological and industrial innovation hub.

      Industrial progress calls for platforms to converge industry strengths. Taking place October 14–16 at the Shenzhen Convention and Exhibition Center (Futian), this annual semiconductor flagship event carries the theme “Chip to the Future, Smart Ecosystem”. With a planned exhibition area of over 70,000 sqm, it will bring together more than 1,000 high-quality enterprises across the semiconductor chain, including suppliers of equipment, materials and core components. The show is projected to attract over 70,000 professional visitors, alongside more than 40 high-level forums and technical sessions running concurrently.

      Spanning critical equipment, components and materials through to new compute capacity for the AI era, The WESEMiBAY Semiconductor Ecosystem Expo serves not only as an arena for global chip industry players, but also as a high-caliber industrial platform featuring technology debuts, supply-demand matchmaking, financing linkage and ecosystem co-creation.