行业标准
Member Intro

【Member Intro】School of Mechanical Engineering, Dalian University of Technology —— Regular Member

日期:2023-08-11阅读:146

Introduction

Found in the year of 1949, the School of Mechanical Engineering of Dalian University of Technology (DUTME) is one of the most influential personnel cultivation and research bases in China. The School has 146 full-time professional staff, 72 out of whom are professors/research fellows. Our faculty have won more than 40 national-level honors and awards, DUTME also possesses Innovation Teams supported by the Nature Science Foundation of China (NSFC), Ministry of Education (MoE) and Ministry of Science and Technology (MoST). The School undertakes a multitude of national scientific research tasks in fields like high-performance manufacturing, precision and ultra-precision machining, micro/nano manufacturing, intelligent mechatronics and major equipment design. DUTME has won more than 80 STEM prizes at provincial and ministerial level, 6 of which ranked the top at national level, including 2 first prizes of the State Technological Invention Award, 1 first prize of the State Scientific and Technological Progress Award(Innovative Groups) and 3 second prizes of the State Technological Invention Award. In order to meet new demands of the new era, DUTME shoulders the new commission to cultivate first-class personnel and generate cutting-edge research achievements, devoting itself to the Strategy of Building a Manufacturing Powerhouse and the great rejuvenation of the Chinese nation.

School of Mechanical Engineering, DUT

Research Team

The high-performance manufacturing team of Dalian University of Technology has a strong technical strength and a solid scientific research foundation in the research direction of ultra-precision machining theory and technology.  We successively undertook and completed many research projects, including the national natural science major funds, key funds, general program, national 863 plan, national 973 plan, provincial and ministerial level science fund and assembly research fund. A lot of research work has been done on the ultra-precision machining of semiconductor materials such as gallium oxide, silicon carbide, gallium nitride, monocrystalline silicon and aluminum nitride. Related research achievements have won 1 first prize of National Technological Invention Award, 1 second prize of National Technological Invention Award, 2 first prize of Technological Invention Award of Ministry of Education, 1 first prize of Science and Technology Progress Award of Ministry of Education, 2 first prize of China Machinery Industry Science and Technology Award, and 1 first prize of Liaoning Provincial Science and Technology Award. Some monographs has been published such as Theory and Technology of Ultra-precision Grinding and Grinding Technology of Difficult to Process Materials, and more than 100 academic papers has been published . More than 60 national invention patents and 3 international patents have been authorized.

Fundamentals of Scientific Research

The School of Mechanical Engineering of Dalian University of Technology has scientific research bases such as "Key Laboratory of Precision and Special Processing of Ministry of Education", "The Key Laboratory Precision / specialty processing and micromanufacturing technology of National Defense, the Ministry of Education", "Liaoning Key Laboratory of Microsystem and Micro-Manufacturing" and "Liaoning Key Laboratory of Advanced Equipment Manufacturing Technology". The research team has complete precision / ultra-precision machining equipment and multi-category analysis and characterization equipment. Grinding and polishing equipment includes: VG 401 ultra-precision grinder, MM7130 precision plane grinder, 602 precision desktop diamond wire cutting machine, grinding wheel on-line electrolytic dressing (EILD) grinding system, CP-4 grinding and polishing testing bench, EJW-610I-1AL CMP equipment and other precision / ultra-precision machining equipment. Micromorphology testing and analysis equipment includes: NewView90003D surface profilometer, FlatMaster200 planar scanner, Q45 SEM, Type JEOL-Model 6360 SEM, XE-200 atomic force microscope, MultiMode atomic force microscopy, VHX-10018-megapixel large depth of field high definition continuous zoom digital microscope, Talysurf CLI 2000 multi-head 3D morphology instrument, Talyrond365-500 roundness measuring instrument, SZX 12 digital stereological microscope and other analytical characterization equipment.

The team has ultra-precision machining equipment and testing instruments

Achievement display

  • Domestic ultra-precision grinding and throwing processing equipment

We have developed the first large-size wafer automatic ultra-precision grinder and the first large-size wafer multi-function ultra-precision grinder at home and abroad, breaking through the key technologies such as grinding force online measurement and control, silicon wafer thickness online measurement, low speed stable feed, grinding surface control, high-precision spindle manufacturing, grinding wheel automatic knife and so on. Related research achievements won the second prize of National Technological Invention in 2019.

Large size wafer automatic ultra-precision grinder and multi-function ultra-precision grinder

  • ultra-precision grinding wheel for hard and brittle chip

According to the requirements of the ultra-precision grinding process in the grinding process, a series of stable and self-sharp diamond grinding wheels are developed; In addition, in view of the problem that the mechanical action of super hard diamond abrasive inevitably leads to the defects of the wafer surface, the mechanical chemical grinding technology of soft abrasive grinding wheel is proposed, and the mechanical chemical grinding series of soft abrasive grinding wheel is developed, which realizes the ultra-low defect surface grinding processing of the wafer.

Surface/Subsurface Quality Partial Inspection Results of Developed Diamond Grinding Wheel and Its Grinding Wafers

Partial surface/sub surface quality inspection results of the developed soft grinding wheel and its grinding chips